Comparison of IMC Growth in Flip-Chip Assemblies with 100- and 200-µm-Pitch SAC305 Solder Joints

Citation: 
Tian, Y., Liu, X., Chow, J., Wu, Y. P., and Sitaraman, S. K., “Comparison of IMC Growth in Flip-Chip Assemblies with 100- and 200-µm-Pitch SAC305 Solder Joints,” 63rd Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2013, pp. 1005-1009.