Elastic-Plastic and Elastic-Viscoplastic Modeling of Plated-Through Holes in Solder Shock Tes

Citation: 
Sizemore, J. and Sitaraman, S. K., “Elastic-Plastic and Elastic-Viscoplastic Modeling of Plated-Through Holes in Solder Shock Test,” HTD-Vol. 319/EEP-Vol. 15, Cooling and Thermal Design of Electronic Systems, Ed. C. H. Amon, ASME International Mechanical Engineering Congress and Exposition, Nov. 12-17, 1995, San Francisco, CA, pp. 163-173.