Warpage and Stress-Strain Distribution in a Sandwich Substrate with Integrated Passives

Citation: 
Dunne, R. C. and Sitaraman, S. K., “Warpage and Stress-Strain Distribution in a Sandwich Substrate with Integrated Passives”, 8th Symposium on Mechanics of Surface Mount Assemblies, 96-WA/EEP-6, ASME International Mechanical Engineering Congress, Atlanta, Nov. 1996.