Thermal Management in Direct Chip Attach Assemblies

Citation: 
Baldwin, D. F., Beerensson, J. T., and Sitaraman, S. K., “Thermal Management in Direct Chip Attach Assemblies,” Sensing, Modeling, and Simulation in Emerging Electronic Packaging Interconnects, Ed. C. Ume, C.-P. Yeh, and K. Chiang, ASME International Mechanical Engineering Congress, Atlanta, Nov. 1996, pp. 29-37.