Role of Underfilling Imperfections on Flip-Chip Reliability

Citation: 
Michaelides, S. and Sitaraman, S. K, “Role of Underfilling Imperfections on Flip-Chip Reliability,” Advances in Electronic Packaging 1997, EEP-Vol. 19-2, ASME, Ed. E. Suhir, Y. C. Lee, M. Shiratori, and G. Subbarayan, pp. 1487-1493.