Thermo-Mechanical Behavior of Vias in HDI Structures

Citation: 
R. C. Dunne, Smith, K. and Sitaraman, S. K., “Thermo-Mechanical Behavior of Vias in HDI Structures,” Advances in Electronic Packaging 1997, EEP-Vol. 19-2, ASME, Ed. E. Suhir, Y. C. Lee, M. Shiratori, and G. Subbarayan, pp. 1305-1311.