Effect of Material and Geometry Parameters on the Thermo-Mechanical Reliability of Flip-Chip Assemblies

Citation: 
Michaelides, S. and Sitaraman, S. K., “Effect of Material and Geometry Parameters on the Thermo-Mechanical Reliability of Flip-Chip Assemblies,” ITHERM’98, The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE-CPMT, ASME, IMAPS, and NIST, Ed. S. H. Bhavnani, G. B. Kromann, and D. J. Nelson, May 1998, pp. 193-200.