Fracture-Mechanics Based Delamination Growth Prediction in the Very Small Peripheral Array Package

Citation: 
Sundararaman, V., Harries, R. J., and Sitaraman, S. K., “Fracture-Mechanics Based Delamination Growth Prediction in the Very Small Peripheral Array Package,” 2nd Electronic Packaging Technology Conference, IEEE-CPMT/ASME/IMAPS, Dec 1998.