Analysis of Interlaminar Thermal Stresses in Unsymmetric Multi-Layered Electronic Assemblies and Packages

Citation: 
Xie, W. and Sitaraman, S. K., “Analysis of Interlaminar Thermal Stresses in Unsymmetric Multi-Layered Electronic Assemblies and Packages,” Advances in Electronic Packaging, EEP-Vol. 26-2, InterPACK 99, ASME, June 1999, pp. 1155-1163.