Experimental Characterization of Copper-Encapsulant Interfacial Fracture Toughness for a Peripheral Array Package

Citation: 
Sundararaman, V. and Sitaraman, S. K., “Experimental Characterization of Copper-Encapsulant Interfacial Fracture Toughness for a Peripheral Array Package,” Advances in Electronic Packaging, EEP-Vol. 26-2, InterPACK 99, ASME, June 1999, pp. 1881-1886.