FEA Modeling of FCOB Assembly Warpage and Stresses due to Underfill Encapsulation and Thermal Cycling Loading

Citation: 
Pang, J. H. L., Chong, Y. R., and Sitaraman, S. K., “FEA Modeling of FCOB Assembly Warpage and Stresses due to Underfill Encapsulation and Thermal Cycling Loading,” Advances in Electronic Packaging, EEP-Vol. 26-1, InterPACK 99, ASME, June 1999, pp. 803-807.