Numerical Study of Copper-Encapsulant Interfacial Delamination Propagation in a Peripheral Array Package

Citation: 
Harries, R. J. and Sitaraman, S. K., “Numerical Study of Copper-Encapsulant Interfacial Delamination Propagation in a Peripheral Array Package,” Advances in Electronic Packaging, EEP-Vol. 26-2, InterPACK 99, ASME, June 1999, pp. 1755-1762.