Design of Simulations Study of Multi-Layered Structures in Electronic Packaging

Citation: 
Variyam, M. and Sitaraman, S. K., “Design of Simulations Study of Multi-Layered Structures in Electronic Packaging,” Advances in Electronic Packaging, EEP-Vol. 26-2, InterPACK 99, ASME, June 1999, pp. 1665-1671.