Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures,

Citation: 
Hu, H., Xie, W., and Sitaraman, S. K., “Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures,” 12th Symposium on Mechanics of SMT and Photonic Structures, Packaging of Electronic and Photonic Devices, ASME IMECE, EEP-Vol. 28, 2000, pp. 103-111.