Compliant Cantilevered Spring Interconnects for Flip-Chip Packaging

Citation: 
Ma, L., Zhu, Q., Modi, M., Sitaraman, S. K., Chua, C., and Fork, D., “Compliant Cantilevered Spring Interconnects for Flip-Chip Packaging,” InterPACK, July 2001, IPACK2001-15695.