Determining Interfacial Delamination Propagation of ViaLuxTM 81/Copper Interface in Multilayered SOP Integrated Substrates

Citation: 
Xie, W., Hu, H., and Sitaraman, S. K., “Determining Interfacial Delamination Propagation of ViaLuxTM 81/Copper Interface in Multilayered SOP Integrated Substrates,” InterPACK, July 2001, IPACK2001-15603.