Mechanics Issues at Micro-Scale Modeling of Electronic Packages

Citation: 
Pucha, R. V., Ramakrishna, G., and Sitaraman, S. K., “Mechanics Issues at Micro-Scale Modeling of Electronic Packages,” Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition, Nov. 2001, New York, NY, IMECE2001/EPP-24709.