Thermomechanical Reliability of High Density Wiring Substrates

Citation: 
Hegde, S., Pucha, R. V., Takahashi, A., and Sitaraman, S. K., "Thermomechanical Reliability of High Density Wiring Substrates," ITHERM’2002, The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE-CPMT, ASME, and IMAPS, pp. 919-925.