Process-Induced Stress Effect on Reliability of ChipSeal® Passivation Technology

Citation: 
Kim, Y.K., Krondorfer, R and Sitaraman, S.K (2002). Process-Induced Stress Effect on Reliability of ChipSeal® Passivation Technology. Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, LA, IMECE2002/EPP-39681.