Enhanced reliability of high density wiring (HDW) substrates through new dielectric and base substrate materials

Citation: 
Hegde, S., Pucha, R.V and Sitaraman, S.K. (2002). Enhanced reliability of high density wiring (HDW) substrates through new dielectric and base substrate materials. Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, LA, IMECE2002/EPP-39671.