Electroplated Compliant Wafer-Level G-Helix Interconnect: A Solution to Future Electronic Packaging

Citation: 
Zhu, Q., Ma, L., and Sitaraman, S. K., “Electroplated Compliant Wafer-Level G-Helix Interconnect: A Solution to Future Electronic Packaging,” InterPACK’03, International Electronic Packaging Technical Conference and Exhibition, July 2003, InterPack2003-35342.