Contact Reliability of Innovative Compliant Interconnects for Next Generation Electronic Packaging

Citation: 
Ma, L., Zhu, Q., and Sitaraman, S K., “Contact Reliability of Innovative Compliant Interconnects for Next Generation Electronic Packaging,” Proceedings of IMECE’03, 2003 ASME International Mechanical Engineering Congress, November 15-21, 2003, Washington, DC, IMECE2003-41753.