Material Interaction Effects in the Reliability of High-Density Interconnect (HDI) Boards,

Citation: 
Mahalingam, S., Hegde, S., Ramakrishna, G., Pucha, R. V., and Sitaraman, S. K., “Material Interaction Effects in the Reliability of High-Density Interconnect (HDI) Boards,” Proceedings of IMECE’03, 2003 ASME International Mechanical Engineering Congress, November 15-21, 2003, Washington, DC, IMECE2003-41645.