Thermo-Mechanical Evaluation of Embedded Optical Interconnects on Board

Citation: 
Hegde, S. and Sitaraman, S. K., " Thermo-Mechanical Evaluation of Embedded Optical Interconnects on Board," ITHERM’2004, The Nineth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Proceedings Vol. II, IEEE-CPMT, ASME, and IMAPS, June 2004, pp. 274-279.