Compliant Stress-Engineered Interconnects for Next-Generation Packaging

Citation: 
Klein, K. and Sitaraman, S. K., “Compliant Stress-Engineered Interconnects for Next-Generation Packaging,” Proceedings of IMECE2004, 2004 ASME International Mechanical Engineering Congress, November 13-19, 2004, Anaheim, California, USA, IMECE2004-61990.