A Fracture Mechanics Analyis of Underfill Delamination in Flip Chip Packages

Citation: 
Mahalingam, S., Tonapi, S., and Sitaraman, S., “A Fracture Mechanics Analyis of Underfill Delamination in Flip Chip Packages,” InterPACK ’05, The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, July 2005, San Francisco, CA, USA, IPACK2005-73493.