The characterization of Underfill-Passivation Interface under Monotonic and Fatigue Loading and its Application to Flip Chip Reliability Prediction

Citation: 
Mahalingam, S., Tonapi, S., Sitaraman, S., and Goray, K., “The characterization of Underfill-Passivation Interface under Monotonic and Fatigue Loading and its Application to Flip Chip Reliability Prediction,” Proceedings of IMECE2005, 2005 ASME International Mechanical Engineering Congress, November 2005, Orlando, Florida, USA, IMECE2005-83029.