Reliable Design of Electroplated Copper Through Silicon Vias

Citation: 
Liu, X., Chen, Q., Sundaram, V., Muthukumar, S., Tummala, R. R., and Sitaraman, S. K., “Reliable Design of Electroplated Copper Through Silicon Vias,” Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition (IMECE2010), November 2010, Vancouver, British Columbia, Canada, IMECE2010-39283.