Reliability Design of TSV in Free-Standing and 3D Integrated Packages

Citation: 
Liu, X., Simmons-Matthews, M., Wachtler, K. P., and Sitaraman, S. K., “Reliability Design of TSV in Free-Standing and 3D Integrated Packages,” Proceedings of the ASME 2011 International Mechanical Engineering Congress and Exposition (IMECE2011), November 2011, Denver, Colorado, IMECE2011-65767.