Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

Citation: 
Dunne, R. C. and Sitaraman, S. K., “Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)”, Transactions of the ASME - Journal of Electronic Packaging, Vol. 119, Sep. 1997, pp.197-203.