A Modeling Method for the Study of Thermo-Mechanical Behavior of HDI Vias

Citation: 
Johnson, C., Smith, K. and Sitaraman, S. K., “A Modeling Method for the Study of Thermo-Mechanical Behavior of HDI Vias,” The IMAPS International Journal of Microcircuits and Electronic Packaging, Volume 21, Number 2, Second Quarter 1998, pp. 177-185.