High-Temperature, Low-Modulus Adhesive Attach for Large-Area Thin-Film Processing on Silicon and Alumina Tiles

Citation: 
Variyam, M., Sundararaman, V., Sitaraman, S. K., Wong, C. P., Wu, J., and Pike, R. T., “High-Temperature, Low-Modulus Adhesive Attach for Large-Area Thin-Film Processing on Silicon and Alumina Tiles,” IEEE Transactions on Electronics Packaging Manufacturing, IEEE-Components, Packaging, and Manufacturing Technology Society, Vol. 22, No. 4, Oct. 1999, pp. 290-294.