Die Cracking and Reliable Die Design for Flip-Chip Assemblies

Citation: 
Michaelides, S. and Sitaraman, S. K., “Die Cracking and Reliable Die Design for Flip-Chip Assemblies,” IEEE Transactions on Advanced Packaging, IEEE-Components, Packaging, and Manufacturing Technology Society, Vol. 22, No. 4, November 1999, pp. 602-613.