Investigation of the Curing Behavior of a Novel Epoxy Photo-Dielectric Dry Film (ViaLux 81) for High Density Interconnect Applications

Citation: 
Dunne, R. C., Sitaraman, S. K., Luo, S., Rao, Y., Wong, C. P., Estes, W. E., Gonzalez, C. G., Coburn, J. C., and Periyasamy, M., “Investigation of the Curing Behavior of a Novel Epoxy Photo-Dielectric Dry Film (ViaLux 81) for High Density Interconnect Applications”, Journal of Applied Polymer Science, Vol. 78, 2000, pp. 430-437.