New Reworkable High-Temperature Low-Modulus Adhesives for MCM-D Assembly

Citation: 
Wu, J., Pike, R. T., Sitaraman, S., and Wong, C. P., “New Reworkable High-Temperature Low-Modulus Adhesives for MCM-D Assembly,” Transactions of the ASME - Journal of Electronic Packaging, Vol. 122, March 2000, pp. 55-60.