Thermal and Mechanical Characterization of ViaLux 81: A Novel Epoxy Photo-Dielectric Dry Film (PDDF) for Microvia Applications

Citation: 
Dunne, R. C., Sitaraman, S. K., Luo, S., Wong, C. P., Estes, W. E., Periyasamy, M., Coburn, J. C., “Thermal and Mechanical Characterization of ViaLux 81: A Novel Epoxy Photo-Dielectric Dry Film (PDDF) for Microvia Applications,” 50th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2000, pp. 592-600. IEEE Transactions – Components and Packaging Technologies, Vol. 24, No. 3, Sep. 2001, pp. 436-444.