Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages

Citation: 
Pucha, R. V., Pyland, J., and Sitaraman, S. K., “Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages,” International Journal of Damage Mechanics, July 2001, Vol. 10, pp. 214-234.