Interfacial Fracture Toughness for Delamination Growth Prediction in a Novel Peripheral Array Package,

Citation: 
Sundararaman, V. and Sitaraman, S. K., “Interfacial Fracture Toughness for Delamination Growth Prediction in a Novel Peripheral Array Package,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, June 2001, pp. 265-270.