Numerical Modeling of Interfacial Delamination Propagation in a Novel Peripheral Array Package

Citation: 
Harries, R. J. and Sitaraman, S. K., “Numerical Modeling of Interfacial Delamination Propagation in a Novel Peripheral Array Package,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, June 2001, pp. 256-264.