An Integrated Process Modeling Methodology and Module for Sequential Multilayered Substrate Fabrication using a Coupled Cure-Thermal-Stress Analysis Approach

Citation: 
Dunne, R. C. and Sitaraman, S. K., “An Integrated Process Modeling Methodology and Module for Sequential Multilayered Substrate Fabrication using a Coupled Cure-Thermal-Stress Analysis Approach,” 50th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2000, pp. 1311-1319. Also, IEEE Transactions – Electronics Packaging Manufacturing, Vol. 25, No. 4, 2002, pp. 326-334.