Study of Coupled Thermal Electric Behavior of Compliant Micro-Spring Interconnects For Next Generation Probing Applications

Citation: 
Ahmad, M. and Sitaraman, S. K., “Study of Coupled Thermal Electric Behavior of Compliant Micro-Spring Interconnects For Next Generation Probing Applications,” IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 2, June 2003, pp. 407-415.