Investigation of Interfacial Delamination of a Copper-Epoxy Interface under Monotonic and Cyclic Loading: Modeling and Evaluation

Citation: 
Xie, W. and Sitaraman, S. K., “Investigation of Interfacial Delamination of a Copper-Epoxy Interface under Monotonic and Cyclic Loading: Modeling and Evaluation,” IEEE Transactions on Advanced Packaging, Vol. 26, No. 4, Nov. 2003, pp. 441-446.