FEM Modeling of Temperature Distribution of a Flip-Chip No-Flow Underfill Package during Solder Reflow Process

Citation: 
Zhang, Z., Sitaraman, S. K., and Wong, C. P., “FEM Modeling of Temperature Distribution of a Flip-Chip No-Flow Underfill Package during Solder Reflow Process,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, No. 1, January 2004, pp. 86-92.