Modeling Spatial Strain Gradient Effects in Thermo-mechanical Fatigue of Copper Microstructures

Citation: 
Pucha, R., Ramakrishna, G., Mahalingam, S., and Sitaraman, S. K., “Modeling Spatial Strain Gradient Effects in Thermo-mechanical Fatigue of Copper Microstructures,” International Journal of Fatigue, Vol. 26, 2004, pp. 947-957.