Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging

Citation: 
Kumbhat, N.P., Raj, M.P., Pucha, R.V., Tsai, J.Y., Atmur, S., Bongio, E., Sitaraman, S.K., and Tummala, R.R., “Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging,” IEEE Transactions on Advanced Packaging, Vol. 30, No. 4, Nov. 2007, pp. 641-653.