An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Citation: 
Tunga, K. and Sitaraman, S. K., “An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls,” Transactions of the ASME – Journal of Electronic Packaging, Vol. 129, Dec. 2007, pp. 427-433. Also, Tunga, K. and Sitaraman, S. K., “Thermo-Mechanical Fatigue Life Estimation of Organic BGA Packages using Laser Moiré Interferometry,” IMECE2006-ASME, November 2006, Chicago, IL, USA, IMECE2006-13615.