A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance

Citation: 
Kacker, K., Sokol, T., Yun, W., Swaminathan, M., and Sitaraman, S. K., “A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance," Transactions of the ASME – Journal of Electronic Packaging, Vol. 129, Dec. 2007, pp. 460-468.