Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package under Extended Dwell Times

Citation: 
Tunga, K. and Sitaraman, S. K., "Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package under Extended Dwell Times," Experimental Mechanics, 48(3), 2008, pp. 355-365.