Compliant Off-Chip Interconnects for Use in Electronic Packages and Fabrication Methods

Kacker, K. and Sitaraman, S. K., “Compliant Off-Chip Interconnects for Use in Electronic Packages and Fabrication Methods,” U. S. Patent No. 8,382,489 B2, Feb. 26, 2013.

type: 
US Patent
Year: 
2 013