Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array

Citation: 
Perkins, A. and Sitaraman, S.K. "Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array (CCGA) Package," Transactions of ASME - Journal of Electronic Packaging, Vol. 130, No. 1, 2008, pp. 011012-1-11.